?2008 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FAN9611 " Rev. 1.1.7
2
Ordering Information
Part Number
Package
Packing Method
Packing
Quantity
FAN9611MX
16-Lead, Small Outline Integrated Circuit (SOIC)
Tape and Reel
2,500
This device passed wave soldering test by JESD22A-111.
Package Outlines
Figure 2. SOIC-16 (Top View)
Thermal Resistance Table
Package
Suffix
Thermal Resistance
?/DIV>
JL
(1)
?/DIV>
JA
(2)
16-Lead SOIC
M
35癈/W
50 120癈/W
(3)
Notes:
1. Typical ?/DIV>
JL
is specified from semiconductor junction to lead.
2. Typical ?/DIV>
JA
is dependent on the PCB design and operating conditions, such as air flow. The range of values
covers a variety of operating conditions utilizing natural convection with no heatsink on the package.
3. This typical range is an estimate; actual values depend on the application.
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